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  2. Professor William John Plumbridge

Professor William John Plumbridge

Profile summary

  • Visiting Informal Academic
  • Emeritus Professor
  • Faculty of Science, Technology, Engineering & Mathematics
  • william.plumbridge

Publications

New avenues for failure analysis (2009)
Plumbridge, W. J.
Engineering Failure Analysis, 16(5) (pp. 1347-1354)
Fatigue resistance and structure (30 years on) (2009)
Plumbridge, W. J.
Fatigue and Fracture of Engineering Materials and Structures, 32(6) (pp. 461-463)
Recent Observations on Tin Pest Formation in Solder Alloys (2008-02)
Plumbridge, W. J.
Journal of Electronic Materials, 37(2) (pp. 218-223)
Damage Produced in Solder Alloys during Thermal Cycling (2007-09)
Liu, X. W. and Plumbridge, W. J.
Journal of Electronic Materials, 36(9) (pp. 1111-1120)
Tin pest issues in lead-free electronic solders (2007-03)
Plumbridge, W.J.
Journal of Materials Science: Materials in Electronics, 18(1-3) (pp. 307-318)
Tin pest in electronics? (2007)
Plumbridge, W.J.
Circuit World, 33(1) (pp. 9-14)
Defects in electronics and their significance for structural integrity (2007)
Plumbridge, W. J.
Fatigue and Fracture of Engineering Materials and Structures, 30(5) (pp. 432-442)
Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach (2006-05)
Rist, Martin A.; Plumbridge, W.J. and Cooper, S.
Journal of Electronic Materials, 35(5) (pp. 1050-1058)
Implementing lead-free solders - the performance aspects (2006)
Plumbridge, W.J.
Soldering and Surface Mount Technology, 18(1) (pp. 11-18)
Second generation lead-free solder alloys: a challenge to thermodynamics (2005-11)
Plumbridge, William J.
Monatshefte fur Chemie / Chemical Monthly, 136(11) (pp. 1811-1821)
Structural integrity in electronics (2004-08)
Plumbridge, W.J. and Kariya, Y.
Fatigue and Fracture of Engineering Materials and Structures, 27(8) (pp. 723-734)
Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy (2004-08)
Shohji, Ikuo; Gagg, Colin and Plumbridge, William J.
Journal of Electronic Materials, 33(8) (pp. 923-927)
Long term mechanical reliability with lead-free solders (2004)
Plumbridge, W.J.
Soldering and Surface Mount Technology, 16(2) (pp. 13-20)
Thermomechanical fatigue of Sn–37 wt.% Pb model solder joints (2003-12-05)
Liu, X.W. and Plumbridge, W.J.
Materials Science and Engineering A, 362(1-2) (pp. 309-321)
Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling (2003-04)
Liu, X.W. and Plumbridge, W.J.
Journal of Electronic Materials, 32(4) (pp. 278-286)
The analysis of creep data for solder alloys (2003)
Plumbridge, W.J.
Soldering and Surface Mount Technology, 15(1) (pp. 26-30)
The creep of lead-free solders at elevated temperatures (2001-09)
Plumbridge, W. J.; Gagg, C. R. and Peters, S.
Journal of Electronic Materials, 30(9) (pp. 1178-1183)
Tin pest in Sn-0.5 wt.% Cu lead-free solder (2001-06)
Kariya, Yoshiharu; Williams, Naomi; Gagg, Colin and Plumbridge, William
JOM Journal of the Minerals, Metals and Materials Society, 53(6) (pp. 39-41)
Tin pest in lead-free solders (2001)
Kariya, Yoshiharu; Gagg, Colin and Plumbridge, William J.
Soldering and Surface Mount Technology, 13(1) (pp. 39-40)
The mechanical properties of lead-containing and lead-free solders—meeting the environmental challenge (2000)
Plumbridge, W. J. and Gagg, C. R.
Proceedings of the Institution of Mechanical Engineers Part L, Journal of Materials: Design and Applications, 214(3) (pp. 153-161)
Effects of strain rate and temperature on the stress–strain response of solder alloys (1999-07)
Plumbridge, W. J. and Gagg, C. R.
Journal of Materials Science: Materials in Electronics, 10(5-6) (pp. 461-468)
High temperature crack annealing effects on fracture toughness of alumina and alumina-SiC composite (1996)
Moffatt, J.; Plumbridge, W. and Herman, R
British Ceramic Transactions, 95(1) (pp. 23-29)
A comparison of crack initiation techniques for ceramics (1995-02-01)
Hermann, R.; Moffatt, J. and Plumbridge, W. J.
Journal of Materials Science Letters, 14(4) (pp. 282-284)
Structural integrity and reliability in electronics: enhancing performance in a lead-free environment (2004)
Plumbridge, W.J.; Matela, R.J. and Westwater, A.
ISBN : 978-1-4020-1765-0 | Publisher : Springer | Published : The Netherlands
Mechanical evaluation in electronics (2003)
Plumbridge, William
In: Suganama, K. ed. Lead-free soldering in electronics: Science, technology and environmental impact (pp. 183-218)
ISBN : 824741021 | Publisher : Marcel Dekker | Published : New York
The influence of temperature on the creep of tin-37 lead solders (2002-10)
Plumbridge, W. J. and Gagg, C. R.
In : TMS Fall Meeting (6-10 Oct 2002, Columbus Ohio, USA)
The influence of processing history on the creep of tin-3.5 silver alloys (2001)
Plumbridge, W.; Kariya, Y. and Gagg, C. R.
In : Seventh Symposium on Microjoining and Assembly Technology in Electronics (MATE 2001) (2001, Yokohama, Japan)
Allotropic transformation study and phase mapping in tin-copper lead-free solder for electronic assembly (2000-06)
Kariya, Y.; Gagg, C. R.; Williams, N. and Plumbridge, W. J.
In : CHANNEL Users Meeting (15-18 Jun 2000, Hobro, Denmark)
Solders for the Next Millennium (1998-04)
Plumbridge, W. J.; Gagg, C. R. and Moffatt, J.
In : Materials Congress; Institute of Materials (6-8 Apr 1998, Cirencester, Wilts)
The effect of ageing on the creep of a eutectic lead-tin alloy (1996-10-30)
Gagg, Colin and Plumbridge, William
In : British Association for Brazing and Soldering (BABS) Autumn Conference (30-31 Oct 1996, Birmingham)

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